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Thermal Release Double Sided TapeDouble sided tape for temporary bonding

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• Thermal Release Double Sided Tape is a tape that is manufactured in clean room for the semiconductor manufacturing processes. In other applications, it can be used for support substrate for temporary bonding while achieving little-to-low contamination after debonding from bonded surface.

Characteristics and Construction

• Temporary bonding to the adherend

  “Zero stress debonding” by thermal foaming

  Achieves low contamination after debonding from bonded surface

  By taking advantage of the material design technology that we have cultivated in the semiconductor industry, we can add features suitable for your processes and needs such as heat resistance and antistatic property.

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Characteristics

Actual Applications
　-　Mold process for semiconductors, etc.

Other Applications
　-　During precision machinery and electronic components processing
　ー　Substrate/stages for manufacturing processes such as 3D printers, etc.

Molding

Handling of Fragile Materials

Handling of Thin Materials

Heat Resistance and “Zero Stress” Debonding

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