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Thermal Release Double Sided TapeDouble sided tape for temporary bonding

  • Thermal Release Double Sided Tape (Double sided tape for temporary bonding)
  • Thermal Release Double Sided Tape is a tape that is manufactured in clean room for the semiconductor manufacturing processes. In other applications, it can be used for support substrate for temporary bonding while achieving little-to-low contamination after debonding from bonded surface.

Characteristics and Construction

  • Temporary bonding to the adherend

    “Zero stress debonding” by thermal foaming

    Achieves low contamination after debonding from bonded surface

    By taking advantage of the material design technology that we have cultivated in the semiconductor industry, we can add features suitable for your processes and needs such as heat resistance and antistatic property.

  • Construction

Characteristics

Actual Applications
 ー Mold process for semiconductors, etc.

Other Applications
 ー During precision machinery and electronic components processing
 ー Substrate/stages for manufacturing processes such as 3D printers, etc.

Molding
Molding
Handling of Fragile Materials
Handling of Fragile Materials
Handling of Thin Materials
Handling of Thin Materials

Heat Resistance and “Zero Stress” Debonding

Heat Resistance and “Zero Stress” Debonding

Inquiry about this product Protective Film Business Division Sales Dept. ICROS Sales Management Group Phone 81-3-6895-5711 Monday to Friday, 9am to 5:30pm

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