Thermal Release Double Sided TapeDouble sided tape for temporary bonding
Thermal Release Double Sided Tape is a tape that is manufactured in clean room for the semiconductor manufacturing processes. In other applications, it can be used for support substrate for temporary bonding while achieving little-to-low contamination after debonding from bonded surface.
Characteristics and Construction
Temporary bonding to the adherend
“Zero stress debonding” by thermal foaming
Achieves low contamination after debonding from bonded surface
By taking advantage of the material design technology that we have cultivated in the semiconductor industry, we can add features suitable for your processes and needs such as heat resistance and antistatic property.
ー Mold process for semiconductors, etc.
ー During precision machinery and electronic components processing
ー Substrate/stages for manufacturing processes such as 3D printers, etc.