ICROS™ tape is used in semiconductor industry and expanding for other application that involves cleanroom environment. We provide best solution to match your product and process requirements.
ICROS™ tape is usually 3 layers, but some tapes have more layers depending on surface construction of wafer/substrate and process requirements.
Each layer has different functions and combination of multiple layers provides various solutions for your needs.
We offer best proposal for your process from dozens of our tapes from our portfolio.
ICROS™ tape is mainly used in semiconductor back-end process such as wafer backgrinding (BG), wafer dicing (DC) and packaging.
ICROS™ tape protects sensitive product from damage and contamination during process and supports process handling.
Application is not just for semiconductor production process but also for other products manufactured under clean environment such as sensor device, optics, MEMS and so on.
Tape which is designed to peel-off from wafer/substrate material without UV irradiation
Tape which can be peeled off from wafer/substrate material easily after UV irradiation
Tape which can be released from wafer/substrate material with zero-stress when certain temperature is applied
Tape where thickness uniformity is controlled under strict production management
Tape which uses flexible material in order to withstand mechanical transformation
Tape which is suitable for optical inspection or laser processing through the tape
Tape which has both properties by our polymerization technologies
Tape which has encapsulation function to protect designs laid out on surface of wafer / substrate material during manufacturing process
Tape which can withstand process with high temperature
Tape which can withstand process that uses chemicals such as solvent and acid
Tape which has conductive property to allow electric discharge
[Trademarks and registered trademarks of respective companies]
*1: “Stealth Dicing” is a trademark or registered trademark of Hamamatsu Photonics K.K.
*2: “DBG” is a trademark or registered trademark of LINTEC Corporation, DISCO Corporation and Kioxia Corporation.
*3: “TAIKO” is a trademark or registered trademark of DISCO Corporation
Our global network offers on-time technical solutions and supports customer’s business worldwide. Our R&D supports customer’s process optimization, material analysis, and tape development using equipements in our laboratory, and collaborate with external machine makers to provide best solution.
We started development of tape for semiconductor process in 1980s, and ICROS™ tape commercialized in 1987.
ICROS™ tape is now used worldwide, and our customers are located in 25+ countries and region.
We own the No.1 global market share* of wafer backgrinding tape.
*according to our research, as of November 2020
Some ICROS™ tapes use non-solvent adhesive so it does not emit no air pollutants and ecotoxic substances during tape manufacturing process.
We continue to make an active contributions to the environment.