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Opulent™Heat-resistant release film
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High-performance polyolefin film with potential applications
■Transparency / ■UV ray permeability / ■Heat resistance / ■Releasability / ■Cushioning property / ■Gas permeability / ■Transferability / ■Non silicone
Opulent™ is made from TPX™ polymethylpentene resin, which is produced solely by Mitsui Chemicals, Inc. It provides an excellent heat resistance and releasability in addition to fitting any uneven surface. That's why it's used in flexible print-circuit board (FPC) factories around the world as a release film in their FPC manufacturing operations. Opulent™ is also used as heat-resistant release film for various other applications.
Features
■ Transparency
Permeable to UV rays.
■ Heat resistance
Withstands temperatures up to around 200℃.
■ Releasability
Releasable from various materials.
■ Superior cushioning property
Fits to any surface pattern.
■ Gas permeability
Its unique molecular structure makes it permeable to gasses.
■ Non silicon (non-silicone)
Since it's made from non-silicon (non-silicone) materials, there's no risk of contamination or transfer from silicon materials.
■ Transferability
Its excellent transfer and release performance makes it ideal for transfer printing.
Structure
*Embossed film is also available.
Applications
■ Release film for flexible print-circuit board, rigid-flex print-circuit board and rigid print-circuit board
Opulent™ provides an excellent balance between heat resistance and releasability in addition to fitting the contours of just about any surface. No wonder it's such a popular release film for flexible print-circuit board.
■ Release film for prepreg and pressing (CFRP, GFRP, AFRP, etc.)
Opulent™ is widely used as a release film for prepreg processing and makes an exceptional release film for curing prepreg made of glass cloth, carbon or aramid fiber as well as epoxy resin.
■ Film for thermoset resin processing
The superior heat resistance of our Opulent™ makes it the perfect choice of release film for molding thermoset resins such as epoxy and phenolic resins.
■ Film for transfer printing
The outstanding release performance of Opulent™ has brought transfer printing to new heights. After printing on the TPX film (Opulent™), the film is transferred to the substrate and heated so it adheres to the surface. The film's superior cushioning and flexibility enable perfect transfer printing to uneven surfaces.
An In-depth Look
■ Transparency
Able to transmit UV rays.
Ten pieces of 50 mm film on printed material
■ Heat Resistance
With a melting point of approximately 230℃, Opulent™ can be processed at a temperature of 200℃.
■ Release Property
An excellent release film for a variety of materials.
Opulent™ indicates superior release performance when used with various materials, including epoxy resins, due to its low surface tension.
Its low surface tension enables Opulent™ to repel water.
■ Cushioning Property
Fits to any contour.
With a softening temperature of approximately 40#8451;, Opulent™ easily fits to any contour.
■ Gas Permeability
Opulent™'s unique molecular structure makes it permeable to gasses.
Although Opulent™ is a nonporous film, it's as gas permeable as micro-porous film.
Grades and Properties
| Grade | Single-layer film | |||||||
| X-44B | X-88B | X-88BMT4 | ||||||
| Thickness | 50μm | 50μm | 50μm | |||||
| Item | Unit | Test method / Surface treatment |
Untreated surface (gloss) |
Untreated surface (gloss) |
Both sides embossed (both sides matte) |
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| Yield point strength (MD) |
Mpa | ASTM D882 | 25 | 30 | 29 | |||
| Tensile strength (MD) |
Mpa | ASTM D882 | 30 | 33 | 32 | |||
| Softening temperature | ℃ | Mitsui Chemicals Tohcello method*1 | 47 | 52 | 52 | |||
| Dimensional change rate after heating (MD) |
％ | Mitsui Chemicals Tohcello method*2 | 1.4 | 1.6 | -0.6 | |||
| Dimensional change rate after heating (TD) |
％ | Mitsui Chemicals Tohcello method*2 | -0.9 | -1.1 | 0.3 | |||
| Structure | ●Single-layer |
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| Grade | Multi-layer film | |||||
| CR1012 | CR1012MT4 | CR1040 | CR2031MT4 | |||
| Thickness | 150μm | 150μm | 150μｍ | 120μm | ||
| Item | Unit | Test method /Surface treatment |
Untreated surface (gloss) |
Both sides embossed (both sides matte) |
Untreated surface (gloss) |
Both sides embossed (both sides matte) |
| Yield point strength (MD) |
MPa | ASTM D882 | 20 | 19 | 13 | 22 |
| Tensile strength (MD) |
MPa | ASTM D882 | 22 | 23 | 19 | 26 |
| Softening temperature |
℃ | Mitsui Chemicals Tohcello method(*1) |
42 | 42 | 29 | 46 |
| Dimensional change rate after heating (MD) |
％ | Mitsui Chemicals Tohcello method(*2) |
0.7 | 0 | 1.0 | -1.6 |
| Dimensional change rate after heating (TD) |
％ | Mitsui Chemicals Tohcello method(*2) |
-1.0 | -0.4 | -0.7 | 0.5 |
| Structure | ●Multi-layer |
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- *1: Softening temperature is the temperate at which the tensile modulus reaches 300 MPa.
- *2: Involves heating a film specimen in an oven, cooling it to room temperature, and then measuring its dimensions.
- Specimen: 300 mm×300 mm; Heating conditions: 170℃ for 30 min;
Dimensional change ratio after heating = (dimensions after heating - original dimensions) / original dimensions X 100
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