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Opulent™Heat-resistant release film

  • Opulent™ (Heat-resistant release film)
  • High-performance polyolefin film with potential applications

    ■Transparency / ■UV ray permeability / ■Heat resistance / ■Releasability / ■Cushioning property / ■Gas permeability / ■Transferability / ■Non silicone

Opulent™ (Heat-resistant release film)

Opulent™ is made from TPX™ polymethylpentene resin, which is produced solely by Mitsui Chemicals, Inc. It provides an excellent heat resistance and releasability in addition to fitting any uneven surface. That's why it's used in flexible print-circuit board (FPC) factories around the world as a release film in their FPC manufacturing operations. Opulent™ is also used as heat-resistant release film for various other applications.

Features

■ Transparency

Permeable to UV rays.

■ Heat resistance

Withstands temperatures up to around 200℃.

■ Releasability

Releasable from various materials.

■ Superior cushioning property

Fits to any surface pattern.

■ Gas permeability

Its unique molecular structure makes it permeable to gasses.

■ Non silicon (non-silicone)

Since it's made from non-silicon (non-silicone) materials, there's no risk of contamination or transfer from silicon materials.

■ Transferability

Its excellent transfer and release performance makes it ideal for transfer printing.

Structure

Single-layer film Multi-layer film

*Embossed film is also available.

Applications

Opulent™ (Heat-resistant release film)

■ Release film for flexible print-circuit board, rigid-flex print-circuit board and rigid print-circuit board

Opulent™ provides an excellent balance between heat resistance and releasability in addition to fitting the contours of just about any surface. No wonder it's such a popular release film for flexible print-circuit board.

■ Release film for prepreg and pressing (CFRP, GFRP, AFRP, etc.)

Opulent™ is widely used as a release film for prepreg processing and makes an exceptional release film for curing prepreg made of glass cloth, carbon or aramid fiber as well as epoxy resin.

■ Film for thermoset resin processing

The superior heat resistance of our Opulent™ makes it the perfect choice of release film for molding thermoset resins such as epoxy and phenolic resins.

■ Film for transfer printing

The outstanding release performance of Opulent™ has brought transfer printing to new heights. After printing on the TPX film (Opulent™), the film is transferred to the substrate and heated so it adheres to the surface. The film's superior cushioning and flexibility enable perfect transfer printing to uneven surfaces.

An In-depth Look

■ Transparency

Able to transmit UV rays.

Ten pieces of 50 mm film on printed material

Ten pieces of 50 mm film on printed material

■ Heat Resistance

With a melting point of approximately 230℃, Opulent™ can be processed at a temperature of 200℃.

With a melting point of approximately 230℃, Opulent™ can be processed at a temperature of 200℃.

■ Release Property

An excellent release film for a variety of materials.
Opulent™ indicates superior release performance when used with various materials, including epoxy resins, due to its low surface tension.

Its low surface tension enables Opulent™ to repel water.

Its low surface tension enables Opulent™ to repel water.

  • ■ Cushioning Property

    Fits to any contour.
    With a softening temperature of approximately 40#8451;, Opulent™ easily fits to any contour.

  • Fits to any contour.

Fits to any contour.

  • ■ Gas Permeability

    Opulent™'s unique molecular structure makes it permeable to gasses.
    Although Opulent™ is a nonporous film, it's as gas permeable as micro-porous film.

  • Although Opulent™ is a nonporous film, it's as gas permeable as micro-porous film.

Grades and Properties

Grade Single-layer film
X-44B X-88B X-88BMT4
Thickness 25μm 50μm 50μm(*1) 50μm(*1)
Item Unit Test method /
Surface treatment
Untreated surface
(gloss)
Untreated surface
(gloss)
Untreated surface
(gloss)
Both sides embossed
(both sides matte)
Yield point strength
(MD)
Mpa ASTM D882 26 25 30 29
Tensile strength
(MD)
Mpa ASTM D882 40 30 33 32
Softening temperature Mitsui Chemicals Tohcello method*2 47 47 52 52
Dimensional change rate after heating
(MD)
Mitsui Chemicals Tohcello method*3 2.1 1.4 1.6 -0.6
Dimensional change rate after heating
(TD)
Mitsui Chemicals Tohcello method*3 -1.8 -0.9 -1.1 0.3
Structure ●Single-layer
Single-layer
Grade Multi-layer film
CR1012 CR1012MT4 CR1040 CR2031MT4
Thickness 150μm 150μm 150μm 120μm
Item Unit Test method
/Surface
treatment
Untreated
surface
(gloss)
Both
sides
embossed
(both sides matte)
Untreated
surface
(gloss)
Both
sides
embossed
(both sides matte)
Yield point strength
(MD)
MPa ASTM D882 20 19 13 22
Tensile strength
(MD)
MPa ASTM D882 22 23 19 26
Softening
temperature
Mitsui Chemicals
Tohcello method(*2)
42 42 29 46
Dimensional
change rate
after heating
(MD)
Mitsui Chemicals
Tohcello method(*3)
0.7 0 1.0 -1.6
Dimensional
change rate
after heating
(TD)
Mitsui Chemicals
Tohcello method(*3)
-1.0 -0.4 -0.7 0.5
Structure ●Multi-layer
Multi-layer
  • *1: 100 μm thick film is also available.
  • *2: Softening temperature is the temperate at which the tensile modulus reaches 300 MPa.
  • *3: Involves heating a film specimen in an oven, cooling it to room temperature, and then measuring its dimensions.
  • Specimen: 300 mm×300 mm; Heating conditions: 170℃ for 30 min; Dimensional change ratio after heating = (dimensions after heating - original dimensions) / original dimensions X 100

Inquiry about this product Release Film Marketing Department Phone 81-3-6895-5710 Monday to Friday, 9am to 5:30pm

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