HOME > Our Products > Industrial Films > ICROS™TAPE (Ultra clean protective tape)
Used as a protective tape for formed circuit on wafer surface during the back grinding process of the semi-conductor manufacturing process.
- Low contamination
- Controls wafer surface contamination to a minimum.
- Minimizes wafer breakage
- Reduces wafer breakage during the back grinding process.
- High accuracy
- Maintains excellent wafer thickness uniformity after the back grinding process.
The adhesive is optimized for application with electronic materials from the resin design to the coating conditions so that low contamination characteristics are maintained even after the tape is removed. As a result, the rinsing process that ordinarily follows de-taping can be simplified or eliminated, greatly contributing to keeping the environment clean. During the processing of thinned wafers, the tape contributes a great deal to improved yield (by preventing wafer breakage) as using it allows stage reduction.
Protective tape for the wafer circuit surface during the wafer back grinding process
Product Search
